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Wiring board

專利號
US10834818B2
公開日期
2020-11-10
申請人
NGK SPARK PLUG CO., LTD.(JP Nagoya)
發(fā)明人
Takakuni Nasu; Kengo Tanimori; Yousuke Kondo; Masahiro Kamegai; Kouta Kimata; Junya Matsura; Fumio Shiraki; Guangzhu Jin
IPC分類
H05K1/11; H01L23/00; H01L23/14; H01L23/48; H01L23/52; G01R1/073
技術(shù)領(lǐng)域
electrode,pad,ceramic,board,holes,insulator,4a,bulge,wiring,in
地域: Nagoya

摘要

A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.

說明書

1 2 3 4 5 6 7 8 9 10 11 12 13
Example 1

Samples 1, 2, and 3 were prepared such that each of them included a ceramic board and a plurality of the electrode pads 4 formed on the ceramic board. Each of the electrode pads 4 was formed according to the first embodiment as shown in FIG. 1, and was sized such that: a length of each side of the electrode pad 4 in planar view was 920 μm; a thickness of the electrode pad 4 was 16 μm; the interval D between the through holes 4A was 20 μm; and the width of the central part 41 was 350 μm.

Each of the through holes 4A was formed to have sides of: 25 μm in the sample 1; 21 μm in the sample 2; and 17 μm in the sample 3. The samples 1, 2, and 3 were heated at 330° C. and checked for the bulge in the electrode pad 4. As a result, none of the samples included the bulge in the electrode pad 4.

Example 2

Samples 4, 5, and 6 were prepared such that each of them included a ceramic board and a plurality of the electrode pads 4 formed on the ceramic board, wherein each of the electrode pads 4 was same in size with that of the example 1, except for the thickness of the electrode pads 4 which was set to 5 μm.

Each of the through holes 4A was formed to have sides of: 25 μm in the sample 4; 21 μm in the sample 5; and 17 μm in the sample 6. The samples 4, 5, and 6 were heated at 330° C. and checked for the bulge in the electrode pad 4. As a result, none of the samples included the bulge in the electrode pad 4.

Comparative Example 1

權(quán)利要求

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