[First Embodiment] As shown in FIG. 1, a wiring board 1 includes a ceramic board 2 and an electrode pad 4. Although the electrode pad 4 is one in number in FIG. 1, the wiring board 1 may include a plurality of the electrode pads 4.

The wiring board 1 according to the present embodiment serves as, for example, a wiring board for a probe card used in electrical inspection of a wafer including semiconductors. The probe card wiring board is provided with probes mounted thereto upon the inspection of wafer.

<Ceramic Board> As shown in FIG. 2, the ceramic board 2 includes insulator layers 21, 22, 23, and 24 composed mainly of ceramic, and wiring (not shown) formed in these insulator layers.

The main component mentioned above means a component accounting 90% in mass. Incidentally, although the insulator layers are four in number in FIG. 2, the number is not limited to four, but may be one.

The wiring of the ceramic board 2 includes: wiring patterns formed such that each of the insulator layers has in its surface, at least one of the wiring patterns; and a conductor 3 (a via) extending through the insulator layers in their thickness direction. Although the conductor 3 is one in number in FIG. 2, the ceramic board 2 may include a plurality of the conductors 3.

The wiring of the ceramic board 2 is made of metal such as tungsten (W), molybdenum (Mo), manganese (Mn), copper (Cu), silver (Ag), and alloy of these metals. Tungsten is especially preferable in view of heat resistance during firing.