(2a) For example, the wiring board 1 may further include a resin board including a resin insulator layer composed mainly of resin, wherein the resin board is stacked with the ceramic board 2.

(2b) The electrode pad 4 may be configured without the peripheral part 42. In other words, the through holes 4A may be formed over the whole part of the electrode pad 4 in planar view.

(2c) The conductor 3 and the through holes 4A may be located to avoid the center of the electrode pad 4. For example, as shown in FIG. 3, the conductor 3 and the through holes 4A (namely, the central part 41) may be located at a corner of the electrode pad 4. Thus-forming the through holes 4A at the corner serves to suppress a terminal of a probe etc. from being caught in the through holes 4A upon joining the terminal to the center of the electrode pad 4, and thereby suppress a fault from occurring upon installation of the terminal.

(2d) The embodiments described above may be modified by: replacing one of the components with a combination of components serving the same function; replacing some of the components with an integrated component serving the same functions; omitting some of the features; adding some of the features of another one of the embodiments; and/or replacing the features with some of the features of another one of the embodiments. The present disclosure may be implemented by any embodiments based on technical ideas defined by the following claims.

The following describes methods and results of tests that were implemented for confirming the beneficial effects of the embodiments of the present disclosure.