Barrier for hybrid socket movement reduction
地域：
NY
NY Armonk
摘要
Aspects of the invention include an apparatus to aid a surface mount connection process including a barrier, a substrate in a facing spaced relationship with the barrier, a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, and at least one fastening mechanism securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket.
說明書
The present invention generally relates to area array devices, and more specifically, to sockets for area array devices.
An area array device has an array of electrical contacts on a face of the device, instead of having pins or other contacts around a perimeter of the device. An array of contact pads provides far more electrical connections than do contacts around a perimeter. Area array devices also have heat conduction and electrical performance advantages. Area array devices can be electrically connected by using a socket, or by directly soldering the contact pads to form connections.
Embodiments of the present invention are directed to a barrier for hybrid socket movement reduction.
According to one or more embodiments of the present invention, an apparatus to aid a surface mount connection process is provided. The apparatus includes a barrier, a substrate in a facing spaced relationship with the barrier, a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, and at least one fastening mechanism securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket.
權利要求
What is claimed is:1. An apparatus to aid a surface mount connection process, the apparatus comprising:a barrier; a substrate in a facing spaced relationship with the barrier; a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, the hybrid LGA socket comprising a first surface and a second surface opposite the first surface, wherein the first surface comprises socket contact pads and the second surface comprising socket contact posts; and at least one fastening mechanism securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket, wherein the barrier is directly connected to the substrate through the at least one fastening mechanism and not through the hybrid LGA socket. 2. The apparatus of claim 1 , wherein the fastening mechanism maintains the selected distance between the barrier and the substrate during a surface mount connection process connecting the hybrid LGA socket and the substrate. 3. The apparatus of claim 1 , wherein the barrier further comprises:a first side; a second side opposite the first side; and an orifice extending from the first side to the second side. 4. The apparatus of claim 1 , wherein the barrier further comprises:a first side; a second side opposite the first side; and orifices in a grid pattern, each of the orifices extending from the first side to the second side. 5. The apparatus of claim 4 , wherein each of the orifices are square in shape. 6. The apparatus of claim 1 , wherein the barrier further comprises:a first side; a second side opposite the first side; and four orifices in a triangular grid pattern, each of the four orifices extending from the first side to the second side. 7. The apparatus of claim 1 , wherein the barrier further comprises:a first side; a second side opposite the first side; and four orifices in a square grid pattern, each of the four orifices extending from the first side to the second side, wherein each of the four orifices are square in shape. 8. The apparatus of claim 1 , wherein the barrier further comprises:a first side; a second side opposite the first side; a border forming an outer perimeter of the barrier; and an orifice extending from the first side to the second side, the orifice being located within the border. 9. The apparatus of claim 1 , wherein the surface mount connection process is a solder reflow process. 10. A method of surface mount connecting a hybrid land grid array (LGA) socket to a substrate, the method comprising:applying connecting material onto a substrate contact pad of the substrate; placing the hybrid LGA socket onto the substrate such that a socket contact pad of the hybrid LGA socket aligns with the substrate contact pad, the hybrid LGA socket comprising a first surface and a second surface opposite the first surface, wherein the first surface comprises socket contact pads and the second surface comprising socket contact posts; attaching a barrier to the substrate using at least one fastening mechanism, the substrate being in a facing spaced relationship with the barrier and the hybrid LGA socket being interposed between the barrier and the substrate; and adjusting and securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket, wherein the barrier is directly connected to the substrate through the at least one fastening mechanism and not through the hybrid LGA socket. 11. The method of claim 10 , further comprising:heating at least the hybrid LGA socket, the connecting material, the substrate, the barrier, and the at least one fastening mechanism. 12. The method of claim 11 , further comprising:radiating heat from the hybrid LGA socket through an orifice located in the barrier, the orifice extending from a first side of the barrier to a second side of the barrier. 13. The method of claim 11 , further comprising:radiating heat from the hybrid LGA socket through orifices located in the barrier, the orifice extending from a first side of the barrier to a second side of the barrier, wherein the orifices are in a grid pattern. 14. The method of claim 13 , wherein each of the orifices are square in shape. 15. The method of claim 11 , further comprising:radiating heat from the hybrid LGA socket through four orifices located in the barrier, each of the four orifices extending from a first side of the barrier to a second side of the barrier, wherein the four orifices are in a triangular grid pattern. 16. The method of claim 11 , further comprising:radiating heat from the hybrid LGA socket through four orifices located in the barrier, each of the four orifices extending from a first side of the barrier to a second side of the barrier, wherein the four orifices are in a square grid pattern, and wherein each of the four orifices are square in shape. 17. The method of claim 11 , further comprising:radiating heat from the hybrid LGA socket through an orifice located in the barrier, the orifice extending from a first side of the barrier to a second side of the barrier, wherein the orifice is located within a border of the barrier, the border forming an outer perimeter of the barrier. 18. A barrier to aid a surface mount connection process,the barrier comprising: a first side; a second side opposite the first side; one or more orifices extending from the first side to the second side; and at least one fastening mechanism operable to secure the barrier to a substrate at a selected distance such that a gap is formed between the barrier and a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, the hybrid LGA socket comprising a first surface and a second surface opposite the first surface, wherein the first surface comprises socket contact pads and the second surface comprising socket contact posts, wherein the barrier is configured to directly connect to the substrate through the at least one fastening mechanism and not through the hybrid LGA socket. 19. The barrier of claim 18 , wherein the fastening mechanism maintains the selected distance between the barrier and the substrate during a surface mount connection process connecting the hybrid LGA socket and the substrate. 20. The barrier of claim 18 , wherein the one or more orifices are in a grid pattern.
意見反饋