According to another embodiment of the present invention, a method of surface mount connecting a hybrid LGA socket to a substrate is provided. The method includes applying connecting material onto a substrate contact pad of the substrate and placing the hybrid LGA socket onto the substrate such that a socket contact pad of the hybrid LGA socket aligns with the substrate contact pad. The method also includes attaching a barrier to the substrate using at least one fastening mechanism. The substrate being in a facing spaced relationship with the barrier and the hybrid LGA socket being interposed between the barrier and the substrate. The method further includes adjusting and securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket.

According to another embodiment of the present invention, a barrier to aid a surface mount connection process is provided. The barrier includes a first side, a second side opposite the first side, one or more orifices extending from the first side to the second side, and at least one fastening mechanism operable to secure the barrier to a substrate at a selected distance such that a gap is formed between the barrier and a hybrid LGA socket interposed between the barrier and the substrate.

Additional technical features and benefits are realized through the techniques of the present invention. Embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed subject matter. For a better understanding, refer to the detailed description and to the drawings.