The LGA sockets sometimes provide a large number of electrical connections for an area array device. These LGA sockets are sized large enough to fit each of the electrical connections that they provide. For a hybrid LGA socket, this means that in addition to the contacts for the area array device, there is often a large number of surface mount connections for connection to a substrate. Often solder balls are used for the surface mount connection.

The high temperatures used during reflow soldering can cause a hybrid LGA socket to expand, contract, bend, distort, or warp, leading to misaligned or non-wet connections between the hybrid LGA socket and the substrate. These problems can increase with larger hybrid LGA sockets, as the higher surface areas between the sockets and the substrate make it more difficult to maintain sufficient flatness for forming successful electrical connections. Differential expansion and contraction of a hybrid LGA socket due to heating and cooling of the socket during reflow soldering can cause a permanent distortion or warpage of the finished socket assembly, especially for large hybrid LGA sockets.

From the foregoing discussion, it should be apparent that a need exists for an apparatus, system, and method to maintain socket contacts. Beneficially, such an apparatus, system, and method would maintain socket contacts during a surface mount connection process.

Embodiments disclosed herein been developed in response to the present state of the art, and in particular, in response to the problems and needs in the art that have not yet been fully solved by currently available area array device socket alignment techniques. Accordingly, the present invention has been developed to provide an apparatus, system, and method for socket contact alignment that overcome many or all of the above-discussed shortcomings in the art.