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Barrier for hybrid socket movement reduction

專利號(hào)
US10834839B1
公開日期
2020-11-10
申請人
INTERNATIONAL BUSINESS MACHINES CORPORATION(US NY Armonk)
發(fā)明人
Theron Lee Lewis; Timothy Jennings; Timothy Younger; David Braun; John R. Dangler; Jennifer I. Bennett; James Bielick; Stephen Hugo
IPC分類
H05K7/10; H05K13/04; H01R13/24; H01R12/52; H01L23/498; H05K3/34; H01L23/00; H01L21/768
技術(shù)領(lǐng)域
socket,lga,pads,barrier,hybrid,contact,substrate,orifices,in,posts
地域: NY NY Armonk

摘要

Aspects of the invention include an apparatus to aid a surface mount connection process including a barrier, a substrate in a facing spaced relationship with the barrier, a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, and at least one fastening mechanism securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket.

說明書

One or more embodiments of the present invention provide technological improvements over current methods to maintain socket contacts during a surface mount connection process that require force to be applied to the socket. One or more embodiments of the present invention provide technical solutions to one or more of these disadvantages of existing solutions by using a barrier located at a distance away from the socket to barrier to maintain socket contacts during a surface mount connection process.

權(quán)利要求

1
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