Cold plate device for a two-phase cooling system
地域：
NY
NY Armonk
摘要
Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.
說明書
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This invention was made with Government support under Contract No.: FA8650-14-C-7466 awarded by Defense Advanced Research Projects Agency (DARPA). The Government has certain rights to this invention.
The subject disclosure relates to liquid cooling systems, and more specifically, to two-phase cooling systems for electronics.
The following presents a summary to provide a basic understanding of one or more embodiments of the invention. This summary is not intended to identify key or critical elements, or delineate any scope of the particular embodiments or any scope of the claims. Its sole purpose is to present concepts in a simplified form as a prelude to the more detailed description that is presented later. In one or more embodiments described herein, systems, methods, apparatuses and/or devices that facilitate two-phase cooling of an electronic device are described.
According to an embodiment, an apparatus can comprise a first stackable layer and a second stackable layer. The first stackable layer can comprise a first channel formed within the first stackable layer. The first channel can comprise a first channel width. Furthermore, the first channel can receive a coolant fluid via an inlet port of the apparatus. The second stackable layer can comprise a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel can increase along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.
權(quán)利要求
What is claimed is:1. An apparatus, comprising:a first stackable layer that comprises a first channel formed within the first stackable layer, wherein the first channel receives a coolant fluid via an inlet port of the apparatus; and a second stackable layer that comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus, wherein the first channel and the second channel form a set of expanding channels for the apparatus, and wherein a height of the set of expanding channels and a width of the set of expanding channels increases along a flow direction of the coolant fluid through the apparatus, wherein the second channel comprises a patterned through-hole region of the second stackable layer, and comprises a through-hole region distinct from the patterned through-hole region and that provides a second path for the coolant fluid to flow between the inlet port and the first channel, and wherein a size of the through-hole region corresponds to a distance between a portion of the through-hole region and the patterned through-hole region. 2. The apparatus of claim 1 , wherein the second channel comprises a first channel height that is different than a second channel height of the first channel. 3. The apparatus of claim 1 , wherein the first channel comprises a plurality of raised step structures. 4. The apparatus of claim 3 , wherein a height of a raised step structure from the plurality of raised step structures is less than another height of the first channel. 5. The apparatus of claim 3 , wherein an orientation of the plurality of raised step structures is perpendicular to a flow direction of the coolant fluid through the apparatus. 6. The apparatus of claim 3 , wherein an orientation of the plurality of raised step structures is angled relative to a flow direction of the coolant fluid through the apparatus. 7. The apparatus of claim 3 , wherein the apparatus is adapted to be coupled to an electronic device. 8. The apparatus of claim 7 , wherein a location of at least a portion of the plurality of raised step structures corresponds to a region of the electronic device that satisfies a defined criterion. 9. The apparatus of claim 1 , wherein the first channel comprises a first raised structure, and wherein there is a defined distance between the first raised structure and a second raised structure. 10. The apparatus of claim 9 , wherein a solid material region is located between the first raised structure and the second raised structure. 11. An apparatus, comprising:a first stackable layer that comprises a first channel formed within the first stackable layer, wherein the first channel receives a coolant fluid via an inlet port of the apparatus; a second stackable layer that comprises a second channel that provides a path for the coolant fluid to flow, wherein the first channel and the second channel form a set of expanding channels for the apparatus, and wherein a height of the set of expanding channels increases along a flow direction of the coolant fluid through the apparatus, and wherein the second channel comprises a patterned through-hole region of the second stackable layer, and comprises a through-hole region distinct from the patterned through-hole region and that provides a second path for the coolant fluid to flow between the inlet port and the first channel, and wherein a size of the through-hole region corresponds to a distance between a portion of the through-hole region and the patterned through-hole region; and an auxiliary channel that receives the coolant fluid from an inlet channel having the inlet port, wherein the auxiliary channel comprises a nozzle region that facilitates directed cooling for a hot spot region of the apparatus. 12. The apparatus of claim 11 , wherein the second channel comprises a first channel height that is different than a second channel height of the first channel, and wherein the nozzle region is an opening that creates jet impingement and spray cooling for the hot spot region. 13. The apparatus of claim 11 , wherein the first channel comprises a plurality of raised step structures, and wherein a height of a raised step structure from the plurality of raised step structures is less than another height of the first channel. 14. The apparatus of claim 13 , wherein an orientation of the plurality of raised step structures is perpendicular to a flow direction of the coolant fluid through the apparatus. 15. An apparatus, comprising:a first stackable layer that comprises a first channel formed within the first stackable layer, wherein the first channel receives a coolant fluid via an inlet port of the apparatus; a second stackable layer that comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus, wherein the first channel and the second channel form a set of expanding channels for the apparatus, and wherein a width of the set of expanding channels increases along a flow direction of the coolant fluid through the apparatus, wherein the second channel comprises a patterned through-hole region of the second stackable layer, and comprises a through-hole region distinct from the patterned through-hole region and that provides a second path for the coolant fluid to flow between the inlet port and the first channel, and wherein a size of the through-hole region corresponds to a step length of a third stackable layer, and the step length corresponds to a distance between a portion of the through-hole region and the patterned through-hole region. 16. The apparatus of claim 15 , wherein the first channel comprises a plurality of raised step structures, and wherein a height of a raised step structure from the plurality of raised step structures is less than another height of the first channel, and wherein a location of at least a portion of the plurality of raised step structures corresponds to a region at which an electronic device that satisfies a defined criterion couples to the apparatus. 17. The apparatus of claim 15 , wherein a solid material region is located between a first raised structure and a second raised structure of the plurality of raised step structures.
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