Electronic control unit
地域：
Kariya
摘要
An electronic control unit has a substrate that includes a terminal connection portion that is a through hole that extends through the substrate from a first surface to a second surface. A resist opening along an outer edge of the terminal connection portion exposes a circuit pattern from a surface resist layer. A plurality of vias are disposed at positions adjacent to the resist opening in a heat receiving area to facilitate the transfer of heat during a soldering process from the first surface to the second surface.
說明書
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The present application is based on and claims the benefit of priority of Japanese Patent Application No. 2018-137565, filed on Jul. 23, 2018, the disclosure of which is incorporated herein by reference.
The present disclosure relates to an electronic control unit (ECU) and an electric power steering device using the ECU.
Drive devices such as an integrated motor-controller may include connector terminals for inputting and outputting signals to and from the drive device.
The connector terminals may be electrically connected to the substrate of an electronic control unit by a bonding process such as soldering. The substrate may have issues controlling the dissipation of heat during a soldering operation. As such, electronic control units are subject to improvement.
The present disclosure describes an electronic control unit having a substrate that improves the heat dissipation from one surface of a substrate to another surface of the substrate during a soldering operation to improve the connectivity between a substrate and a terminal. The present disclosure also describes an electric power steering device using the electronic control unit.
Objects, features, and advantages of the present disclosure will become more apparent from the following detailed description made with reference to the accompanying drawings, in which:
權利要求
What is claimed is:1. An electronic control unit comprising:a substrate including:a first surface; a second surface disposed opposite the first surface; a plurality of circuit patterns arranged in layers between the first surface and the second surface and layered from a first layer to an n-th layer, where n is an integer of 2 or more; a surface resist layer disposed on the first layer; a terminal connection portion provided as a through hole that pierces the first surface, extends through the substrate, and pierces the second surface, the terminal connection portion disposed at an outermost position near a periphery of the substrate; a resist opening that exposes a first circuit pattern of the first layer along an outer edge of the terminal connection portion; and a plurality of vias disposed at positions adjacent to the resist opening, and an outermost terminal positioned in the terminal connection portion and connected to the terminal connection portion with a connection member, wherein the first surface is a main surface of the substrate near the first layer and the second surface is another main surface of the substrate near the n-th layer, and the plurality of vias include a plurality of outer vias formed in a heat receiving area and on a periphery side of the substrate between the resist opening and the periphery of the substrate, the heat receiving area configured to receive heat from the connection member during a connection process when the outermost terminal is inserted into the terminal connection portion and is connected to the outermost terminal by the connection member, and the surface resist layer is disposed continuously between the resist opening and the plurality of vias. 2. The electronic control unit of claim 1 , whereinthe plurality of vias further includes a plurality of inner vias formed in the heat receiving area and on an inner side of the substrate between the resist opening and a center of the substrate, wherein the inner side of the substrate is opposite to the periphery side with respect to the resist opening. 3. The electronic control unit of claim 2 , whereinthe plurality of vias include a plurality of front side vias that connect the first circuit pattern of the first layer and a second circuit pattern of a second layer, wherein an inside of each of the front side vias is filled with a conductive material, and wherein the first surface of the substrate is covered with the surface resist layer. 4. The electronic control unit of claim 3 , whereinthe plurality of vias further includes a plurality of middle layer vias formed in inner layers of the substrate, the inner layers of the substrate disposed between the first layer and the n-th layer, where n is an integer of 4 or more, and wherein each of the plurality of middle layer vias pierces and extends through middle circuit patterns disposed on the inner layers. 5. The electronic control unit of claim 4 , whereinthe middle layer vias are formed at positions that are offset from positions of the inner vias so that inner front side vias do not overlap the middle layer vias. 6. The electronic control unit of claim 5 , whereinthe middle layer vias are formed at positions closer to the center of the substrate than the terminal connection portion and the inner vias. 7. The electronic control unit of claim 5 , whereinthe second circuit pattern includesan outer circuit pattern configured to connect outer front side vias to the terminal connection portion; and an inner circuit pattern that extends inwardly toward the center of the substrate, wherein a separation gap is disposed between the inner circuit pattern and the outer circuit pattern to separate the inner circuit pattern from the outer circuit pattern, and wherein the inner circuit pattern includes two extension portions that extend to the periphery of the substrate so that each of the extension portions extends on a side of the outer circuit pattern with each of the extension portions separated from the side of the outer circuit pattern by the separation gap, each of the extension portions including a plurality of middle layer vias formed therein that are disposed adjacent to the separation gap and across from the outer circuit pattern. 8. The electronic control unit of claim 4 , whereinthe middle layer vias are formed immediately below the front side vias. 9. The electronic control unit of claim 3 , whereinthe plurality of vias includes a plurality of back side vias formed in the substrate for connecting an n-th circuit pattern of the n-th layer to a circuit pattern on a layer immediately adjacent to the n-th layer, each of the plurality of back side vias filled with a conductive material. 10. The electronic control unit of claim 2 , whereina distance between outermost vias of the plurality of inner vias and corresponding outermost vias of the plurality of outer vias across the terminal connection portion is greater than a distance between individual vias of the plurality of inner vias and the plurality of outer vias. 11. The electronic control unit of claim 1 , whereinthe vias are through hole vias that penetrate the first surface, extend through the substrate, and penetrate the second surface, and wherein the surface resist layer is formed at a position between the vias and the resist openings on the first surface. 12. The electronic control unit of claim 11 , whereineach of the vias is connected to the terminal connection portion by an auxiliary pattern provided for each via. 13. The electronic control unit of claim 11 , whereinthe vias disposed on a center side of the terminal connection portion are provided in a ground circuit pattern extending from the terminal connection portion toward the center of the substrate, and the vias disposed on a periphery side of the terminal connection portion are connected to the terminal connection portion by an auxiliary pattern provided for each of the vias disposed on the periphery side of the terminal connection portion. 14. The electronic control unit of claim 1 , whereinthe circuit patterns formed on a center side of the terminal connection portion on the layers except for the first layer in the substrate include a separator configured to separate a circuit pattern connected to the terminal connection portion from the circuit patterns formed on the center side of the terminal connection portion that extend toward the center of the substrate. 15. The electronic control unit of claim 1 , whereinthe outermost terminal is(i) a power supply terminal configured to connect to a power supply, or (ii) a ground terminal configured to connect to a ground. 16. An electric power steering device comprising:a speed reduction gear; and a drive device includinga motor, and an electronic control unit comprising:a substrate including:a first surface; a second surface disposed opposite the first surface; a plurality of circuit patterns arranged in layers between the first surface and the second surface and layered from a first layer to an n-th layer, where n is an integer of 2 or more; a surface resist layer disposed on the first layer; a terminal connection portion provided as a through hole that pierces the first surface, extends through the substrate, and pierces the second surface, the terminal connection portion disposed at an outermost position near a periphery of the substrate; a resist opening that exposes a first circuit pattern of the first layer along an outer edge of the terminal connection portion; and a plurality of vias disposed at positions adjacent to the resist opening, and an outermost terminal positioned in the terminal connection portion and connected to the outermost terminal with a connection member, wherein the first surface is a main surface of the substrate near the first layer and the second surface is another main surface of the substrate near the n-th layer, and the plurality of vias include a plurality of outer vias formed in a heat receiving area and on a periphery side of the substrate between the resist opening and the periphery of the substrate, the heat receiving area configured to receive heat from the connection member during a connection process when the outermost terminal is inserted into the terminal connection portion and is connected to the outermost terminal by the connection member, and the surface resist layer is disposed continuously between the resist opening and the plurality of vias.
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