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Electronic control unit

專利號
US10834856B2
公開日期
2020-11-10
申請人
DENSO CORPORATION(JP Kariya)
發(fā)明人
Hiroyasu Sugiura
IPC分類
H05K1/02; H05K7/20; H05K1/11; H05K3/34; H02K11/33; B62D5/04; H05K3/42; H05K1/18
技術(shù)領(lǐng)域
vias,terminal,substrate,pattern,circuit,layer,connection,ground,soldering,heat
地域: Kariya

摘要

An electronic control unit has a substrate that includes a terminal connection portion that is a through hole that extends through the substrate from a first surface to a second surface. A resist opening along an outer edge of the terminal connection portion exposes a circuit pattern from a surface resist layer. A plurality of vias are disposed at positions adjacent to the resist opening in a heat receiving area to facilitate the transfer of heat during a soldering process from the first surface to the second surface.

說明書

The substrate 30 may be, for example, a printed circuit board (PCB). The substrate 30 has one main side (i.e., main face/main surface) facing the rear frame end 837 and one main side facing the connector portion 462. The facing directions of the main surfaces of the substrate 30 may also be described relative to the motor 80, for example, as facing the motor 80 or facing away from the motor 80.

As shown in FIG. 7, the substrate 30 may be a four layer substrate having multilayer through holes (e.g., through hole vias) bored through one or more of the layers to electrically connect circuits on different layers. In the present embodiment, since the power supply terminal 463 and the ground terminal 464 are inserted into through holes on the substrate 30 on the side of the substrate 30 opposite the motor 80, the tips of the power supply terminal 463 and the ground terminal 464 project toward the motor 80. As such, soldering work to solder the tips of the power supply terminal 463 and the ground terminal 464 to the substrate 30 is performed on the side of the substrate 30 that faces the motor 80 (i.e., on the motor facing side of the substrate 30). Solder may be used to attach electrical components to the substrate 30 and form an electrical connection between such electrical components and the substrate 30. As such, solder may also be referred to as a connection member.

權(quán)利要求

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