The power supply terminal connection portion 33 has a circuit pattern with a width that is greater than half the length of the long side of the power supply terminal connection portion 33 (e.g., greater than half the width of the major axis of the power supply terminal connection portion). For example, the circuit pattern may have a width of 2 mm or more. As such, when the power supply terminal 463 and the power supply terminal connection portion 33 are connected by soldering, the heat can be easily dissipated by the circuit pattern and the heat from the soldering process is not readily transmitted to the second surface 302 of the substrate 30, which may affect the solderability of the power supply terminal 463 to the power supply terminal connection portion 33. On the other hand, in instances where the terminal is narrow, for example, a control terminal where the terminal is a thin wire and where the circuit pattern connected to the connection portion is narrow (not shown), the heat from the soldering process is not so easily dissipated toward the circuit pattern and thus not easily dissipated by the circuit pattern. As such, the heat from a soldering operation that solders the control terminal to the control terminal connection portion may be better transferred from the first surface 301 to the second surface 302 to improve the solderability of the control terminal to the substrate 30. Consequently, when the power supply terminal 463 and the substrate 30 are soldered, the heat from soldering may be dissipated through the wide circuit pattern and the solderability of the power supply terminal 463 to the substrate 30 may be worse than the solderability of the control terminal to the substrate 30. The same applies to the ground terminal 464 as the power supply terminal 463 in terms of soldering, that is, connection to a wide circuit pattern may affect the solderability of the ground terminal 464 to the substrate 30.