Electronic control unit
摘要
說明書
The circuit patterns formed at positions closer to the center of the substrate 30 than the terminal connection portions 33 and 34 include the separators 425, 435, and 445 to separate the circuit patterns connected to the terminal connection portions 33 and 34 from the circuit patterns extending toward the center of the substrate 30. In the present embodiment, the separators 425, 435 and 445 are respectively formed in, i.e., disposed, in the circuit patterns 42, 43, and 44, that is, in the circuit patterns other than the first circuit pattern 41. By including such separators 425, 435, and 445 in the circuit patterns, the radial heat dissipation away from the connection terminals 33 and 34 and to such circuit pattern extending toward the center of the substrate 30 can be reduced and/or eliminated (i.e., suppressed) to improve the heat transfer from the first surface 301 to the second surface 302.
