The middle layer vias 355 and 356 are formed at different positions away from the positions of the vias 351 and 352. That is, the middle layer vias 355 and 356 are formed at positions that are offset from positions of the inner vias 351 and outer vias 352 so that the inner vias 351 and outer vias 352 do not overlap/overlie the middle layer vias 355 and 356. The middle layer vias 355 are formed at positions closer to the center of the substrate 50 than the ground terminal connection portion 34 and the inner vias 351. As such, the positioning of the middle layer vias 355 can better limit and/or prevent heat from being radially dissipated toward the circuit patterns around the center of the substrate 50.

The second circuit pattern 62 includes the outer pattern 622 connecting the outer via 352 and the ground terminal connection portion 34, and the inner pattern 621 extending toward the center of the substrate 50. The inner pattern 621 is formed to extend on both sides of the outer pattern 622. The middle layer vias 356 in the inner pattern 621 are formed on both sides of the outer pattern 622 so as to face the outer pattern 622. By using such a configuration, the size of the inner pattern 621 can be maintained while limiting the heat that is dissipated from the outer pattern 622 to the inner pattern 621. The present embodiment can achieve the same advantageous effect as those described in the previous embodiments.