Component determination device and component determination method
地域：
Chiryu
摘要
A component determination device and a component determination method for an electronic component, the component including a reference section formed as a different member to the multiple electrodes. The component determination device includes: a measuring device configured to measure positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; a plane calculating section configured to calculate a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the positions of the multiple reference points; and a suitability determining section configured to determine whether the electronic component is suitable based on a distance between the reference plane and the multiple measurement points.
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The present application relates to a component determination device and a component determination method.
A component inspection device determines whether, for an electronic component to be mounted on a circuit board, the state of the electrodes on the electronic component and the like are suitable for the usage of the electronic components. For example, in patent literature 1 a configuration is disclosed for performing flatness inspection for multiple electrodes (leads or the like). By determining whether the electronic component is acceptable or not, it is possible to prevent electronic components with defects such as deformed electrodes from being mounted on a circuit board.
Patent literature 1: JP-A-2001-155160
However, there are components that include contact sections that contact the upper surface of a circuit board other than electrodes. The above contact sections, for example, are used for positioning an electronic component with respect to the circuit board, or maintaining the posture of electronic components mounted on the circuit board. For such an electronic component including a contact section, even if the flatness of electrodes is normal, it may not be appropriate to mount the component on the circuit board based on the positional relationship between the electrodes and the contact section.
權(quán)利要求
The invention claimed is:1. A component determination device for determining whether an electronic component is suitable to be mounted on a circuit board, the electronic component including a component main body, multiple electrodes, and a reference section that is formed as a different member to the multiple electrodes and that contacts an upper surface of the circuit board when the electronic component is mounted on the circuit board, the component determination device comprising:a measuring device configured to measure positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; and processing circuitry configured tocalculate a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the positions of the multiple reference points measured by the measuring device; and determine whether all of the multiple electrodes of electronic component contacts an upper surface of the circuit board based on a distance between the reference plane and the multiple measurement points. 2. The component determination device according to claim 1 , whereinone of a positioning hole or a pin section to be inserted into the positioning hole is provided at a specified position of the circuit board, the electronic component includes the other of the positioning hole or the pin section, the reference section includes a regulating surface configured to, when the pin section has been inserted by a predetermined amount into the positioning hole, contact the upper surface of the circuit board so as to regulate the relative movement of the pin section with respect to the positioning hole, and the measuring device measures the position of at least one of the reference points set on the regulating surface among the multiple reference points. 3. The component determination device according to claim 2 , whereina locking hole is provided piercing the circuit board in a thickness direction, and the electronic component includes a locking claw that is inserted into the locking hole and that locks on the lower surface of the circuit board to prevent the pin section that has been inserted into the positioning hole from coming out. 4. The component determination device according to claim 2 , whereinthe positioning hole is provided at the regulating position of the circuit board, the electronic component includes the pin section, the measuring device also measures a position of the pin section at the electronic component, and the processing circuitry determines whether the electronic component is suitable based on the relative position on the reference plane of the multiple measurement points with respect to the position of the pin section. 5. The component determination device according claim 1 , whereineach of the multiple electrodes is arranged lined up in a row in a horizontal direction, and the reference section is arranged lined up on the same row of the multiple electrodes as seen from above the electronic component. 6. The component determination device according to claim 5 , whereinthe reference section is arranged between two adjacent of the electrodes among the multiple electrodes. 7. The component determination device according to claim 1 , whereinthe reference section is one portion of a connecting member that connects the multiple electrodes to each other at a position separated from the component main body. 8. The component determination device according claim 1 , whereinthe measuring device includes a laser emitter that emits a laser light to measure the positions of the multiple reference points and the position of the measurement point set on each of the multiple electrodes. 9. A component determination device for determining whether an electronic component is suitable to be mounted on a circuit board, the electronic component including a component main body, multiple electrodes, and a reference section that is formed as a different member to the multiple electrodes and that is arranged lined up on the same row as the multiple electrodes when the electronic component is viewed from above, the component determination device comprising:a measuring device configured to measure positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; and processing circuitry configured tocalculate a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the positions of the multiple reference points measured by the measuring device; and determine whether all of the multiple electrodes of electronic component contacts an upper surface of the circuit board based on a distance between the reference plane and the multiple measurement points. 10. A component determination method for determining whether an electronic component is suitable to be mounted on a circuit board, the electronic component including a component main body, multiple electrodes, and a reference section that is formed as a different member to the multiple electrodes and that contacts an upper surface of the circuit board when the electronic component is mounted on the circuit board, the component determination method comprising:measuring positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; calculating a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the measured positions of the multiple reference points; and determining whether all of the multiple electrodes of electronic component contacts an upper surface of the circuit board based on a distance between the reference plane and the multiple measurement points. 11. A component determination method for determining whether an electronic component is suitable to be mounted on a circuit board, the electronic component including a component main body, multiple electrodes, and a reference section that is formed as a different member to the multiple electrodes and that is arranged lined up on the same row as the multiple electrodes when the electronic component is viewed from above, the component determination method comprising:measuring positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; calculating a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the measured positions of the multiple reference points; and determining whether all of the multiple electrodes of electronic component contacts an upper surface of the circuit board based on a distance between the reference plane and the multiple measurement points.
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