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Component determination device and component determination method

專利號
US10834861B2
公開日期
2020-11-10
申請人
FUJI CORPORATION（JP Chiryu）
發(fā)明人
Nobuyuki Ishikawa; Katsunori Tanaka
IPC分類
H05K13/08; H05K13/04
技術(shù)領(lǐng)域
component,electronic,board,section,electrodes,circuit,multiple,reference,mounter,84a
地域： Chiryu

摘要

A component determination device and a component determination method for an electronic component, the component including a reference section formed as a different member to the multiple electrodes. The component determination device includes: a measuring device configured to measure positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; a plane calculating section configured to calculate a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the positions of the multiple reference points; and a suitability determining section configured to determine whether the electronic component is suitable based on a distance between the reference plane and the multiple measurement points.

說明書

4. Suitability Determining Processing by Component Determination Device Dp

Suitability determining processing (S30) by component determination device Dp is described with reference FIG. 6. During suitability determining processing (S30), component determination device Dp, first, performs a measuring process of measuring the position of multiple reference points 91 and multiple measurement points 92 set on electronic component 80 using measuring device 50 (S31).

In detail, component determination device Dp recognizes a gripping state of electronic component 80 gripped by a chuck device of mounting head 33 based on image data acquired during imaging processing (S20). Further, component determination device Dp operates component transfer device 30 in accordance with the gripping state of the electronic component 80 and positions the multiple reference points 91 and multiple measurement points 92 above measure device 50 sequentially one by one. While doing this, component determination device Dp measures the positions of the positioned reference points 91 and measurement points 92 using measuring device 50.

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