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Component determination device and component determination method

專利號(hào)
US10834861B2
公開(kāi)日期
2020-11-10
申請(qǐng)人
FUJI CORPORATION(JP Chiryu)
發(fā)明人
Nobuyuki Ishikawa; Katsunori Tanaka
IPC分類
H05K13/08; H05K13/04
技術(shù)領(lǐng)域
component,electronic,board,section,electrodes,circuit,multiple,reference,mounter,84a
地域: Chiryu

摘要

A component determination device and a component determination method for an electronic component, the component including a reference section formed as a different member to the multiple electrodes. The component determination device includes: a measuring device configured to measure positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; a plane calculating section configured to calculate a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the positions of the multiple reference points; and a suitability determining section configured to determine whether the electronic component is suitable based on a distance between the reference plane and the multiple measurement points.

說(shuō)明書(shū)

A component determination method (S30) determines whether an electronic component 80 is suitable to be mounted on a circuit board 70. Electronic component 80 includes: component main body 81; multiple electrodes 82; and a reference section (first reference section 84, second reference section 85) that is formed as a different member to the multiple electrodes 82 and that contacts an upper surface of circuit board 70 when the electronic component 80 is mounted on the circuit board 70. The component determination method (S30) includes: measuring positions of multiple reference points 92 set on the reference section (first reference section 84, second reference section 85) and a position of measurement point 92 set on each of the multiple electrodes 82; calculating reference plane 86 representing a position of the upper surface of circuit board 70 with respect to component main body 81 when electronic component 80 is mounted on circuit board 70 based on the positions of the multiple reference points 92; and determining whether the electronic component 80 is suitable based on a distance between reference plane 86 and the multiple measurement points 92.

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