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Component determination device and component determination method

專利號
US10834861B2
公開日期
2020-11-10
申請人
FUJI CORPORATION(JP Chiryu)
發(fā)明人
Nobuyuki Ishikawa; Katsunori Tanaka
IPC分類
H05K13/08; H05K13/04
技術(shù)領(lǐng)域
component,electronic,board,section,electrodes,circuit,multiple,reference,mounter,84a
地域: Chiryu

摘要

A component determination device and a component determination method for an electronic component, the component including a reference section formed as a different member to the multiple electrodes. The component determination device includes: a measuring device configured to measure positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; a plane calculating section configured to calculate a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the positions of the multiple reference points; and a suitability determining section configured to determine whether the electronic component is suitable based on a distance between the reference plane and the multiple measurement points.

說明書

Also, the reference section (first reference section 84) is a portion of connecting member 83 that connects the multiple electrodes 82 to each other at a position separated from component main body 81. According to such a configuration, connecting member 83, for example, is used as a reinforcing member that stabilizes the shape of the multiple electrodes 82, or as a portion to be gripped during mounting processing. By providing first reference section 84 on connecting member 83 that is close to the multiple electrodes 82 in this manner, it is possible to arrange the multiple reference points 91 close to the multiple measurement points 92, thereby improving the efficiency of position measurement.

Alternative Embodiment

Reference Section

In the present embodiment, the reference section (first reference section 84, second reference section 85) contacts the upper surface of circuit board 70, and is arranged lined up in a row with the multiple electrodes 82. However, the reference section of electronic component 80 on which reference points 91 are set may be configured to be outside lead row F, so long as the reference section is a portion that contacts the upper surface of circuit board 70.

權(quán)利要求

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