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Component determination device and component determination method

專利號
US10834861B2
公開日期
2020-11-10
申請人
FUJI CORPORATION(JP Chiryu)
發(fā)明人
Nobuyuki Ishikawa; Katsunori Tanaka
IPC分類
H05K13/08; H05K13/04
技術(shù)領(lǐng)域
component,electronic,board,section,electrodes,circuit,multiple,reference,mounter,84a
地域: Chiryu

摘要

A component determination device and a component determination method for an electronic component, the component including a reference section formed as a different member to the multiple electrodes. The component determination device includes: a measuring device configured to measure positions of multiple reference points set on the reference section and a position of a measurement point set on each of the multiple electrodes; a plane calculating section configured to calculate a reference plane representing a position of the upper surface of the circuit board with respect to the component main body when the electronic component is mounted on the circuit board based on the positions of the multiple reference points; and a suitability determining section configured to determine whether the electronic component is suitable based on a distance between the reference plane and the multiple measurement points.

說明書

As shown in FIG. 1, electronic component mounter 1 is provided with board conveyance device 10, component supply device 20, component transfer device 30, component camera 41, board camera 42, measuring device 50, and control device 60. In the descriptions below, the horizontal width direction of electronic component mounter 1 (left-right direction in FIG. 1) is the X-axis direction, the horizontal depth direction of electronic component mounter 1 (up-down direction in FIG. 1) is the Y-axis direction, and the direction perpendicular to the X axis and Y axis (perpendicular to the page in FIG. 1) is the Z-axis direction.

Board conveyance device 10 is configured from a belt conveyor or the like and consecutively conveys circuit boards 70 in a conveyance direction. Board conveyance device 10 positions circuit board 70 at a specified position inside electronic component mounter 1. Then, after mounting processing has been performed by electronic component mounter 1, board conveyance device 10 unloads circuit board 70 from electronic component mounter 10.

Component supply device 20 supplies electronic components to be mounted on circuit board 70. Component supply device 20 includes multiple slots arranged lined up in the X direction. Feeders 21 are removably set in each of the multiple slots. Component supply device 20 supplies electronic components to a removal section positioned at the leading end of feeder 21 (the upper side in FIG. 1) by feeder 21 indexing carrier tape.

權(quán)利要求

1
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