Also, component supply device 20, for example, supplies relatively large electronic components such as leaded components in a state lined up on tray 22. Component supply device 20 stores multiple trays 22 in a storage rack divided in the vertical direction, and pulls forward a specified tray 22 according to mounting processing so as to supply electronic components such as leaded components.

Component transfer device 30 is configured to move in the X direction and the Y direction. Component transfer device 30 is arranged from the rear side in the lengthwise direction of electronic component mounter 1 (the upper side in FIG. 1) to above component supply device 20 at the front of electronic component mounter 1. Component transfer device 30 is provided with head driving device 31, moving body 32, and mounting head 33. Head driving device 31 is configured to move moving body 32 in the XY directions using a linear motion mechanism.

Mounting head 33 is removably provided on moving body 32 of head driving device 31. Among mounting heads 33, there is a type that uses suction nozzles (not shown) and a type that uses a chuck device (not shown). A head station (not shown) that stores multiple types of mounting heads 33 is arranged inside electronic component mounter 1. Mounting head 33, for example, is selected appropriately according to the type of electronic component mounted on circuit board 70, with mounting heads 33 on moving body 32 being exchanged automatically or by manual operation of an operator.