Several embodiments include a second pressure sensitive adhesive layer 46 that can be added when the treatment 10 is affixed to a device 20. The second pressure sensitive adhesive layer as described is shown in FIGS. 3, 4, and 8. The second pressure sensitive adhesive layer 46 has a first surface 48 and an oppositely located second surface 50. The first surface 48 has an adhesive coating that will adhere to the component facing surface 34 of the heat spreading material 14. The second pressure sensitive adhesive layer 46 also can serve as an electrical insulator if the material 10 overlays a circuit board with conductive portions that may be shorted if the heat spreader 14 directly contacted those portions. It is common that the second pressure sensitive adhesive layer 46 can be made from a thin material with dielectric properties (such as polyester, polyimide film, PET, or other material) to improve the electrical insulating properties when affixed to device 20. It is further contemplated that the second surface 50 has an adhesive coating (either fully covering surface 50 or selectively placed against surface 50) to allow it to be permanently adhered to a circuit board or other selective heat generating components.