As shown in FIG. 10, due to packaging constraints the treatment 10 may have further densified areas 38 where the insulating layer 12 is further compressed to a smaller thickness. For the embodiment of the treatment 10 with further densified areas 38, the additional densification may occur before the layers are combined or after. The further densified areas 38 retain most of the heat conductive and insulating properties but allow for taller components. FIG. 11 shows the treatment 10 in FIG. 3 as part of a device 20 with the further densified areas 38.

The individual layers that make up the treatment 10 each have a defined thickness that is consistent. One exception is where the insulating layer 12 has further densified areas 38. The insulating layer 12 and heat spreader 14 make up a majority of the thickness of the treatment 10. The pressure sensitive adhesive layers 40, 46 and dielectric layer 39, 43 are typically very thin comparatively.