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Fingerprint identification display panel and fabricating method thereof, fingerprint identification display device

專利號(hào)
US10867155B2
公開(kāi)日期
2020-12-15
申請(qǐng)人
BOE TECHNOLOGY GROUP CO., LTD.(CN Beijing)
發(fā)明人
Hao Zhang; Shiming Shi; Meng Zhao
IPC分類(lèi)
G06K9/00; G06F3/041
技術(shù)領(lǐng)域
pixel,sub,light,emitting,substrate,region,projection,first,second,plurality
地域: Beijing

摘要

A fingerprint identification display panel includes: a substrate; a plurality of sub-pixel regions including a plurality of first, second sub-pixel regions. A first driving circuit and a first light-emitting unit electrically connected thereto are sequentially disposed on the substrate and located in the plurality of first sub-pixel regions. A light shielding layer having through holes are disposed on the substrate. A plurality of light detection units are disposed at a side of the light shielding layer adjacent to the substrate, and corresponds to through holes one by one. At least one through hole is disposed in the second sub-pixel region, and a ratio of an area of an orthographic projection of the through hole on the substrate to an area of an orthographic projection of the second sub-pixel region on the substrate is greater than or equal to 30%.

說(shuō)明書(shū)

forming a light shielding layer having a plurality of through holes on the substrate;

forming a plurality of light detection units at a side of the light shielding layer adjacent to the substrate, the plurality of through holes corresponds to the plurality of light detection units one by one, wherein at least one of the plurality of through holes is disposed in the second sub-pixel region, and a ratio of an area of an orthographic projection of the through hole on the substrate to an area of an orthographic projection of the second sub-pixel region on the substrate is greater than or equal to 30%.

Various steps in the fabricating method for the fingerprint identification display panel described above are not limited in sequence and may be interchanged.

The features, structures, or characteristics described above may be combined in one or more embodiments in any suitable manner, and the features discussed in the various embodiments are interchangeable, if possible. In the following description, numerous specific details are provided in order to fully understand the embodiments of present disclosure. However, the person skilled in the art will appreciate that the technical solution of present disclosure may be practiced without one or more of the specific details, or other methods, components, materials and the like may be employed. In other instances, well-known structures, materials or operations are not shown or described in detail to avoid obscuring aspects of present disclosure.

權(quán)利要求

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