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Data buffer and memory device having the same

專利號(hào)
US10867640B2
公開日期
2020-12-15
申請(qǐng)人
SK hynix Inc.(KR Gyeonggi-do)
發(fā)明人
Jin Ha Hwang
IPC分類
G11C16/26; G11C7/10; G11C7/06
技術(shù)領(lǐng)域
en_1,en_2,memory,node,data,may,voltage,transistor,pmos,d_out
地域: Gyeonggi-do

摘要

There are provided a data buffer and a memory system having the same. The data buffer includes first and second amplifiers configured to output output data by inverting input data, the first and second amplifiers having coupled output nodes to which the output data is output, wherein both of the first and second amplifiers are activated to output the output data when the input data has a first swing level, and wherein one of the first and second amplifiers is activated to output the output data when the input data has a second swing level narrower than the first swing level.

說明書

An ALE pad is a pad to which an address latch enable signal is applied, and may be used to control loading of an address into the memory device 2110. For example, when a high address latch enable signal is applied to the ALE pad, an address may be loaded into the memory device 2110.

A CLE pad is a pad to which a command latch enable signal is applied, and may be used when a command is loaded into the memory device 2110. For example, when a high command latch enable signal is applied to the CLE pad in a wake-up operation, the memory controller 2120 may transmit a status check command to the memory device 2110.

A WP #pad is a terminal to which a write protect signal is applied, and may be used to protect the memory device when a program operation or erase operation is accidentally performed.

The IO pad may be used to transmit a command, an address, and data. For example, eight IO pads IO<1:8> may be included in the memory device 2110.

An R/B #pad may be a pad to which a status signal output from the memory device 2110 is transmitted in response to the status check command. The R/B #pad may be omitted, in which case the IO pad may be used as the R/B #pad.

FIG. 8 is a diagram illustrating a memory device according to an embodiment of the present disclosure, for example, the memory device 2110 of FIG. 7.

權(quán)利要求

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