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Initialization process for magnetic random access memory (MRAM) production

專利號
US10867651B2
公開日期
2020-12-15
申請人
Taiwan Semiconductor Manufacturing Company, Ltd.(TW Hsinchu)
發(fā)明人
Yuan-Jen Lee; Guenole Jan; Huanlong Liu; Jian Zhu
IPC分類
G11C11/00; G11C11/16; H01L27/22; H01L43/02; H01L43/08; H01L43/12; H01L43/10
技術(shù)領(lǐng)域
mtj,ap1,ap2,layer,fl,in,syap,pinned,magnetic,ap
地域: Hsinchu

摘要

An initialization process is disclosed for a perpendicular magnetic tunnel junction (p-MTJ) wherein the switching error rate is reduced from a typical range of 30-100 ppm to less than 10 ppm. In one embodiment, an in-plane magnetic field is applied after a final anneal step is performed during memory device fabrication such that all magnetizations in the free layer, and AP1 and AP2 pinned layers are temporarily aligned “in-plane”. After the applied field is removed, interfacial perpendicular magnetic anisotropy (PMA) at a tunnel barrier/AP1 interface induces a single AP1 magnetic domain with a magnetization in a first vertical direction. Interfacial PMA at a FL/tunnel barrier interface affords a single FL domain with magnetization in the first direction or opposite thereto. AP2 magnetization is opposite to the first direction as a result of antiferromagnetic coupling with the AP1 layer. Alternatively, a perpendicular-to-plane magnetic field may be applied for initialization.

說明書

In yet another embodiment of the present disclosure depicted in FIG. 3a, the p-MTJ in FIG. 1a is modified by adding a second non-magnetic spacer 26 on FL 17, followed in order by a second SyAP pinned layer 25, and an uppermost capping layer 18. The second SyAP pinned layer has AP1 layer 24 contacting a top surface of the second non-magnetic spacer, a middle AFC layer 23, and AP2 layer 22 on the middle AFC layer. Accordingly, a first spin valve structure 10-1 comprised of p-MTJ layers 11-17 is formed on substrate 8, and a second spin valve structure 10-2 comprised of FL 17, second spacer 26, SyAP layer 25, and capping layer 18 is formed on structure 10-1. The double stack of layers is often referred to as a dual magnetic tunnel junction (DMTJ) 10-1/10-2. Layers 25, 26 may have the same composition as in layers 15, 16, respectively, that were described previously.

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