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Initialization process for magnetic random access memory (MRAM) production

專利號(hào)
US10867651B2
公開日期
2020-12-15
申請(qǐng)人
Taiwan Semiconductor Manufacturing Company, Ltd.(TW Hsinchu)
發(fā)明人
Yuan-Jen Lee; Guenole Jan; Huanlong Liu; Jian Zhu
IPC分類
G11C11/00; G11C11/16; H01L27/22; H01L43/02; H01L43/08; H01L43/12; H01L43/10
技術(shù)領(lǐng)域
mtj,ap1,ap2,layer,fl,in,syap,pinned,magnetic,ap
地域: Hsinchu

摘要

An initialization process is disclosed for a perpendicular magnetic tunnel junction (p-MTJ) wherein the switching error rate is reduced from a typical range of 30-100 ppm to less than 10 ppm. In one embodiment, an in-plane magnetic field is applied after a final anneal step is performed during memory device fabrication such that all magnetizations in the free layer, and AP1 and AP2 pinned layers are temporarily aligned “in-plane”. After the applied field is removed, interfacial perpendicular magnetic anisotropy (PMA) at a tunnel barrier/AP1 interface induces a single AP1 magnetic domain with a magnetization in a first vertical direction. Interfacial PMA at a FL/tunnel barrier interface affords a single FL domain with magnetization in the first direction or opposite thereto. AP2 magnetization is opposite to the first direction as a result of antiferromagnetic coupling with the AP1 layer. Alternatively, a perpendicular-to-plane magnetic field may be applied for initialization.

說(shuō)明書

The stability of the magnetizations for the AP1 and AP2 pinned layers is very important for optimum p-MTJ performance in that the antiparallel alignment of the two layers provides the proper spin current for magnetization switching of the free layer during a write process. Ideally, a single domain is formed in both of the AP1 and AP2 layers. However, as a result of the MRAM fabrication process, multiple domains generally form in both pinned layers. Accordingly, spin current during a write process is often weak and insufficient to switch the free layer magnetization.

In order for p-MTJs to be more competitive with competing memory technologies, write performance must be significantly improved while maintaining the other critical device properties such as DRR. Since STT-MRAM is typically embedded in Complementary Metal Oxide Semiconductor (CMOS) devices, the pinned layer and free layer magnetizations must withstand thermal processing up to 400° C. temperatures.

SUMMARY

One objective of the present disclosure is to provide an initialization process to eliminate multiple domains in a pinned layer in a p-MTJ cell such that the current needed to switch free layer magnetization is more uniform and minimized across a plurality of p-MTJ cells in memory devices including MRAM and STT-MRAM, and in other spintronic devices.

A second objective of the present disclosure is to perform the initialization process according to the first objective such that the error rate for switching free layer magnetization is less than 10 ppm.

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