The metal shield layer 5 together with the plating layer 4 (described later) constitutes the outer conductor 8, and the metal shield layer 5 is constituted by braiding or side by side wrapping with metal wires. In the present embodiment, the metal shield layer 5 is being configured as a braided shield composed of braided metal wires. As a material for the metal wires, there is a soft copper wire or a hard copper wire made of e.g. copper or a copper alloy. Further, the metal wires may be made of aluminum or an aluminum alloy. The metal wires may be subjected to a plating on its outer surface.

Further, in the present embodiment, the metal shield layer 5 is configured to include a first braided shield 5a, which is provided over a periphery of the plating layer 4 in such a manner as to be in contact with an outer surface of the plating layer 4, and a second braided shield 5b, which is provided over a periphery of the first braided shield 5a in such a manner as to be in contact with an outer surface of the first braided shield 5a. The formations of the first braided shield 5a and the second braided shield 5b may be performed continuously on the same production line or on separate production lines.