The crack suppressing layer 7 is formed, e.g., by tube extruding the resin over the periphery of the insulator 3. If the outer surface of the insulator 3 is melted by heat during the formation of the crack suppressing layer 7, the insulator 3 and the crack suppressing layer 7 are joined together at the interface with the insulator 3 and the crack suppressing layer 7 being in contact with each other. For the purpose of avoiding this, as the resin to be used in the crack suppressing layer 7, the resin having a lower melting point than that of the resin to be used in the insulator 3 may be used. The crack suppressing layer 7 is formed by tube extruding the resin having a lower melting point than that of the resin to be used in the insulator 3 at a temperature at which the outer surface of the insulator 3 is not melted. Note that the crack suppressing layer 7 may be composed of a plurality of layers.