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High frequency signal transmission cable

專利號
US10867725B1
公開日期
2020-12-15
申請人
Hitachi Metals, Ltd.(JP Tokyo)
發(fā)明人
Detian Huang; Yoshinori Tsukamoto; Masashi Moriyama; Hideyuki Sagawa; Takahiro Sugiyama
IPC分類
H01B7/02; H01B11/06; H01B1/02; H01B13/22; H01B7/30; H01B11/18
技術(shù)領(lǐng)域
insulator,plating,layer,crack,conductor,cable,shield,in,frequency,braided
地域: Tokyo

摘要

A high frequency signal transmission cable includes a conductor, an insulator provided over a periphery of the conductor, a plating layer provided over a periphery of the insulator, and a sheath provided over a periphery of the plating layer. A crack suppressing layer is provided between the insulator and the plating layer, in such a manner as to remain in contact with the insulator while being provided with the plating layer over an outer surface of the crack suppressing layer. The crack suppressing layer suppresses the occurrence of a cracking in the plating layer by bending while moving in a longitudinal direction of the cable relative to a bending of the insulator.

說明書

Incidentally, for example, a connector is attached to an end portion of the high frequency signal transmission cable 1. At this point, the end portion of the high frequency signal transmission cable 1 is subjected to a termination to expose the plating layer 4, the insulator 3, and the inner conductor 2 in a staircase pattern. In the present embodiment, since the crack suppressing layer 7 and the insulator 3 are not being adhered or joined to each other, the plating layer 4 and the crack suppressing layer 7 can easily be peeled off from the outer surface of the insulator 3, and the termination can easily be performed.

Also, the plating layer 4 and the inner conductor 2 exposed by the termination are each connected to a substrate within the connector by soldering or the like. When the plating layer 4 is connected thereto by soldering or the like, the plating layer 4 is heated. At this point, for example, when the plating layer 4 is being formed directly on the outer surface of the insulator 3, the insulator 3 is expanded due to heat, and the plating layer 4 is stretched by following the expansion of the insulator 3, which may therefore cause the plating layer 4 to crack. In the present embodiment, even when the insulator 3 is expanded due to heating the plating layer 4, the crack suppressing layer 7 acts to be slid between the plating layer 4 and the insulator 3 without following this expansion of the insulator 3, so there is also merit that the plating layer 4 is resistant to the occurrence of a cracking resulting from thermal expansion of the insulator 3.

Actions and Advantageous Effects of the Embodiment

權(quán)利要求

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