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High frequency signal transmission cable

專利號(hào)
US10867725B1
公開日期
2020-12-15
申請(qǐng)人
Hitachi Metals, Ltd.(JP Tokyo)
發(fā)明人
Detian Huang; Yoshinori Tsukamoto; Masashi Moriyama; Hideyuki Sagawa; Takahiro Sugiyama
IPC分類
H01B7/02; H01B11/06; H01B1/02; H01B13/22; H01B7/30; H01B11/18
技術(shù)領(lǐng)域
insulator,plating,layer,crack,conductor,cable,shield,in,frequency,braided
地域: Tokyo

摘要

A high frequency signal transmission cable includes a conductor, an insulator provided over a periphery of the conductor, a plating layer provided over a periphery of the insulator, and a sheath provided over a periphery of the plating layer. A crack suppressing layer is provided between the insulator and the plating layer, in such a manner as to remain in contact with the insulator while being provided with the plating layer over an outer surface of the crack suppressing layer. The crack suppressing layer suppresses the occurrence of a cracking in the plating layer by bending while moving in a longitudinal direction of the cable relative to a bending of the insulator.

說明書

  • a metal shield layer (5) provided over a periphery of the plating layer (4).
  • [10] A high frequency signal transmission cable (1), comprising: a conductor (2); an insulator (3) provided over a periphery of the conductor (2); a plating layer (4) provided over a periphery of the insulator (3); and a sheath (6) provided over a periphery of the plating layer (4),

      • wherein a crack suppressing layer (7) is provided between the insulator (3) and the plating layer (4), in such a manner as to remain in contact with the insulator (3) while being provided with the plating layer (4) over an outer surface of the crack suppressing layer (7),
      • wherein an attenuation in a band of not lower than 1.25 GHz and not higher than 6 GHz is not lower than 0.26 dB/m and not higher than 0.80 dB/m.

    Although the embodiments of the present invention have been described above, the above described embodiments are not to be construed as limiting the inventions according to the claims. Further, it should be noted that not all the combinations of the features described in the embodiments are indispensable to the means for solving the problem of the invention.

    Further, the present invention can appropriately be modified and implemented without departing from the spirit thereof. For example, although, in the above embodiment, the foamed resin is being used as the insulator 3, the insulator 3 is not limited to this, but a non-foamed resin may be used as the insulator 3.

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