Next, referring to FIG. 11, a second connection layer 150 may be formed on the second surface of the structure 110. Before forming the second connection layer 150, an insulating layer 190 may be formed on the region E of the second surface of the structure 110. In a case in which the second connection layer 150 is formed after the insulating layer 190 is formed, insulation between the second connection layer 150, and the first electrode 121 and the second electrode 123 may be ensured. The second connection layer 150 may formed by applying a metal paste through a screen printing process.

Next, as illustrated in FIG. 12, a protective layer 180 may be formed on an outer surface of a body by dipping the body in polymer.

Next, as illustrated in FIG. 13, a dicing process of cutting a cross section of the body may be performed. Meanwhile, the operations described with reference to FIGS. 7 through 12 may be performed in a form of a substrate having a width of several tens millimeters (mm) for convenience of processing and efficiency of production, and the substrate may be divided into a size of the capacitor through the dicing process. The dicing process may be performed as a mechanical dicing process, or may be performed as a non-contact dicing process such as a laser dicing process. By such a dicing process, one side 141 of the first connection layer 140 may be exposed to the first side surface of the body and one side 151 of the second connection layer 150 may be exposed to the second side surface of the body.