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Trench capacitor and method of forming the same

專利號
US10868107B2
公開日期
2020-12-15
申請人
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.(TW Hsinchu)
發(fā)明人
Tao-Cheng Liu; Shih-Chi Kuo; Tsai-Hao Hung; Tsung-Hsien Lee
IPC分類
H01L49/02; H01L21/768; H01L29/94; H01L27/08
技術(shù)領(lǐng)域
trench,layer,dielectric,conductive,capacitor,in,substrate,layers,ild,some
地域: Hsinchu

摘要

Methods of manufacturing trench capacitors include forming a trench opening in a substrate, depositing a first dielectric layer over a sidewall and a bottom surface of a first trench opening in a substrate, and depositing a first conductive layer over the first dielectric layer. The first dielectric layer and the first conductive layer are then planarized to expose a planarized top surface of the substrate and a planarized top surface of the first conductive layer in the first trench opening. An ILD layer is deposited over the planarized top surface of the substrate and over the planarized surface of the first conductive layer. A first electrical contact is formed through the ILD layer to provide an electrical connection to the first conductive layer within the first trench opening.

說明書

A second conductive layer 118 is formed over the second dielectric layer 116. In some embodiments, at least one of the first conductive layer 114 or the second conductive layer 118 includes titanium nitride. In some embodiments, both the first conductive layer 114 and the second conductive layer 118 include the same conductive material(s) and/or are deposited to substantially the same thickness. In some embodiments, one or more of the conductive layers of the second conductive layer 118 exhibits a different structure than that of the first conductive layer 114 in terms of the conductive material(s) utilized, the thicknesses of the material layer(s) of the second conductive layer and/or the process(es) used to deposit the second conductive layer.

權(quán)利要求

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