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High voltage device and manufacturing method thereof

專利號(hào)
US10868115B2
公開日期
2020-12-15
申請(qǐng)人
RICHTEK TECHNOLOGY CORPORATION(TW Zhubei)
發(fā)明人
Tsung-Yi Huang; Chu-Feng Chen
IPC分類
H01L29/06; H01L29/66; H01L29/78; H01L21/762
技術(shù)領(lǐng)域
in,voltage,layer,contact,region,deep,well,type,top,drift
地域: Zhubei

摘要

A high voltage device includes: a semiconductor layer, an isolation region, a deep well, a buried layer, a first high voltage well, a first conductivity type well, a second high voltage well, a body region, a body contact, a deep well column, a gate, a source and a drain. The deep well column is located between the drain and a boundary of the conductive layer which is near the source in a channel direction. The deep well column is a minority carriers absorption channel, to avoid turning ON a parasitic transistor in the high voltage device.

說明書

FIGS. 1A and 1B show a top view and a cross-section view of a conventional high voltage device 100, respectively.

FIG. 2 shows a first embodiment of the present invention.

FIG. 3 shows a second embodiment of the present invention.

FIG. 4 shows a third embodiment of the present invention.

FIG. 5 shows a fourth embodiment of the present invention.

FIGS. 6A-6G show a fifth embodiment of the present invention.

DESCRIPTION OF THE PREFERABLE EMBODIMENTS

The drawings as referred to throughout the description of the present invention are for illustration only, to show the interrelations among the process steps and the layers, while the shapes, thicknesses, and widths are not drawn in actual scale.

權(quán)利要求

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