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Circuit structure and method for reducing electronic noises

專利號(hào)
US10868116B2
公開日期
2020-12-15
申請(qǐng)人
Taiwan Semiconductor Manufacturing Co., Ltd.(TW Hsinchu)
發(fā)明人
Ching-Hung Kao; Chi-Feng Huang; Fu-Huan Tsai; Victor Chiang Liang
IPC分類
H01L29/06; H01L29/66; H01L29/78; H01L29/10
技術(shù)領(lǐng)域
ldd,gate,stack,region,isolation,drain,doping,in,feature,hdd
地域: Hsinchu

摘要

In an embodiment, an integrated circuit (IC) device comprises a semiconductor substrate, an isolation region and an active region disposed on the semiconductor substrate, a gate stack disposed over the active region, and a source and a drain disposed in the active region and interposed by the gate stack in a first direction. The active region is at least partially surrounded by the isolation region. A middle portion of the active region laterally extends beyond the gate stack in a second direction that is perpendicular to the first direction.

說明書

Although the active region 106 and the gate stack 114 are illustrated herein as having regular shapes with straight edges, other suitable shapes with polygonal or curve lines are contemplated by the present disclosure. For example, the corner portions 114A-114D may have rounded or straight corners. FIG. 1D shows that the corner portions 114A-114D have a normal angle of 90 degrees (denoted as angle “M”), but this angle may have another value. The active region 106 may or may not have a normal angle (denoted as angle “N”) at the juncture between its middle portion 106A and left and right portions 106B or 106C. Depending on the shape of the active region 106 and the gate stack 114, methods of measuring the various dimensions disclosed herein may vary accordingly.

The various FET structures disclosed herein may have any suitable size or dimension. In some embodiments, when used for analog and radio frequency (RF) applications an FET may have relatively large sizes (e.g., at least hundreds of nanometers in width or length). For example, a, b, c1, and c2 shown in FIG. 1D may each be in the range of 0.03 to 0.3 micrometer (um). Depending on the design, each of a, b, c1, and c2 may be the same or may be different from one another. In some embodiments, L2 is 0.3 um or more (e.g., 0.3-1 um).

權(quán)利要求

1
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