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Method for forming apparatus comprising two dimensional material

專利號
US10868121B2
公開日期
2020-12-15
申請人
Nokia Technologies Oy(FI Espoo)
發(fā)明人
Darryl Cotton; Yinglin Liu; Adam Robinson; Alexander Bessonov; Richard White
IPC分類
H01L29/16; H01L29/66; H01L29/778; H01L31/028; H01L29/12; H01L29/06; H01L29/417; H01L29/423; G01N27/414; H01L31/112
技術(shù)領(lǐng)域
mouldable,layer,graphene,material,release,may,polymer,electrodes,two,be
地域: Espoo

摘要

A method and apparatus, the method comprising: forming a layer of two dimensional material (23), in particular graphene, on a first release layer; forming, possibly a (gate) insulating layer (35), and at least two, preferably three, electrodes (25); forming a second release layer overlaying at least a portion of the layer of two dimensional material; providing a mouldable polymer (24, 26, 28) overlaying the at least two electrodes and the second release layer; and removing the first and second release layers to provide a cavity (29) between the mouldable polymer (26) and the layer of two dimensional material (23).

說明書

Examples of the disclosure provide methods of forming apparatus 21 comprising two or more electrodes 25 and a channel of two dimensional material 23. Providing the discontinuity 29 between the moldable polymer 27 substrate and the layer of two dimensional material 23 prevents the moldable polymer 27 from deforming or otherwise contaminating the layer of two dimensional material 23. This may reduce the number of defects within the layer of two dimensional material 23 which increases carrier mobility within the layer of two dimensional material 23 and provides for an improved apparatus 21.

In some examples the discontinuity 29 may comprise a gas or other fluid which may be configured to prevent contamination of the layer of two dimensional material 23. This may further reduce defects within the layer of two dimensional material 23.

Examples of the disclosure may enable the apparatus 21 to be formed around the layer of two dimensional material 23. This may avoid the need to transfer the layer of two dimensional material 23 which will reduce the chance of the layer of two dimensional material 23 being damaged or otherwise contaminated. As the layer of two dimensional material 23 does not need to be transferred between different substrates this may reduce stresses within the layer which could be formed as the layer is removed from and attached to different substrates. This may also reduce the number of defects within the layer of two dimensional material 23

權(quán)利要求

1
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