FIGS. 10A to 13A are plan views illustrating a method of forming a semiconductor device according to a second embodiment of the inventive concepts;
FIGS. 10B to 13B are cross-sectional views taken along lines I-I′, II-II′, and III-III′ of FIGS. 10A to 13A, respectively;
FIG. 14 is a cross-sectional view corresponding to the line III-III′ of FIG. 13A to illustrate a method of forming a semiconductor device according to a modified embodiment of a second embodiment of the inventive concepts;
FIG. 15A is a plan view illustrating a semiconductor device according to a third embodiment of the inventive concepts;
FIGS. 15B, 15C, 15D, and 15E are cross-sectional views taken along lines I-I′, II-II′, III-III′, and IV-IV′ of FIG. 15A, respectively;
FIG. 15F is a cross-sectional view corresponding to the line IV-IV′ of FIG. 15A to illustrate a semiconductor device according to a modified embodiment of a third embodiment of the inventive concepts;
FIGS. 16A to 20A are plan views illustrating a method of forming a semiconductor device according to a third embodiment of the inventive concepts;
FIGS. 16B to 20B are cross-sectional views taken along lines I-I′ and II-II′ of FIGS. 16A to 20A, respectively;