In exemplary embodiments in which a semiconductor component including the active pattern AP, the gate electrode GE and the source/drain regions 110 is an N-type metal-oxide-semiconductor (NMOS) field effect transistor, the second buffer pattern 106 may provide a tensile strain to the channel pattern 108. In some exemplary embodiments, the second buffer pattern 106 may be formed of Si1-xGex, and the channel pattern 108 may be formed of silicon (Si). In other embodiments, the second buffer pattern 106 may be formed of Si1-xGex, and the channel pattern 108 may be formed of Si1-yGey (where x>y). In still other exemplary embodiments, the second buffer pattern 106 may be formed of In1-xGaxAs, and the channel pattern 108 may be formed of In1-yGayAs (where x<y).
Alternatively, in exemplary embodiments in which the semiconductor component is a P-type MOS (PMOS) field effect transistor, the second buffer pattern 106 may provide a compressive strain to the channel pattern 108. In some exemplary embodiments, the second buffer pattern 106 may be formed of Si1-xGex, and the channel pattern 108 may be formed of germanium (Ge). In other exemplary embodiments, the second buffer pattern 106 may be formed of Si1-zGez, and the channel pattern 108 may be formed of Si1-wGew (where z<w). In still other exemplary embodiments, the second buffer pattern 106 may be formed of In1-zGazAs, and the channel pattern 108 may be formed of In1-wGawAs (where z>w).