Referring to FIGS. 17A, 17B, and 17C, the first mask layer M1 may be removed after the formation of the first doped region r1. The first mask layer M1 may be removed by, for example, an ashing process and/or a strip process. Next, a second mask layer M2 may be formed on the graphene layer 124 including the first doped region r1. The second mask layer M2 may be a photoresist layer, for example. The second mask layer M2 may have a second opening 142 that exposes the graphene 124. The second opening 142 may extend in the first direction D1 and may expose a portion of the top surface of the graphene layer 124. The second opening 142 may be spaced apart from the first doped region r1 in a second direction D2 intersecting the first direction D1 when viewed from a plan view.