The conductive paste may be applied by any suitable method. For example, the conductive paste may be applied by printing, such as by screen printing or inkjet printing. The conductive paste may be applied on a semiconductor substrate to form a light receiving surface electrode of a solar cell. Alternatively, the conductive paste may be applied on a semiconductor substrate to form a back side surface electrode of a solar cell. The solar cell may be an n-type or a p-type solar cell. The paste may be applied onto an n-type emitter (in a p-type solar cell), or onto a p-type emitter (in an n-type solar cell). Some solar cells are known as back junction cells. In this case, it may be preferred that the conductive paste of the present invention is applied to the back side surface of the semiconductor substrate of the solar cell. Such a back side surface is typically covered with an insulating passivation layer (e.g. SiN layer), similar to the anti-reflective coating applied to the light receiving surface of a solar cell. Alternatively, the conductive paste may be applied to a thin film solar cell or the conductive paste may be applied to a substrate for an electronic device other than a solar cell.