Display devices, light emitting diode chips and methods for manufacturing the same
地域：
Kunshan
摘要
The present application relates to a light emitting diode chip including: a first semiconductor layer and a second semiconductor layer. The first semiconductor layer and the second semiconductor layer are laminated to each other, and have an exposed upper surface respectively. An electrode is provided on the upper surfaces of the first semiconductor layer and the second semiconductor layer respectively. The electrode has a first recess in a direction perpendicular to the upper surface.
說(shuō)明書(shū)
This application is a continuation application of International Application No. PCT/CN2018/100298, filed on Aug. 13, 2018, which claims the priority to Chinese Patent Application No. 201820437798. X, entitled “DISPLAY DEVICES, LIGHT EMITTING DIODE CHIPS AND METHODS FOR MANUFACTURING THE SAME”, and filed on Mar. 29, 2018. The entireties of both applications are incorporated by reference herein for all purposes.
Exemplary embodiments of the present application relate to the field of display technologies, and particularly, to display devices, light-emitting diode chips and methods for manufacturing the same.
With the increasing progress of the light emitting diode (LED) chip technology, LED display technology taking LED as a pixel becomes possible. In a process of preparing an LED display device, LED chips distributed in an array need to be transferred to a driving back plate in batches, and then the LED chips are soldered to the driving back plate. At present, micron-scale LED chips have gradually become a mainstream of LED display devices. A Micro-LED (Micro-Light Emitting Diode) chip has a small effective soldering area due to a small size of electrodes. Thus, soldering strength between the electrodes of the Micro-LED chip and the driving back plate will directly affect reliability of a Micro-LED display device.
權(quán)利要求
The invention claimed is:1. A light emitting diode chip, comprising:a first semiconductor layer and a second semiconductor layer, the first semiconductor layer and the second semiconductor layer being laminated to each other, and the first semiconductor layer and the second semiconductor layer having an exposed upper surface respectively; and an electrode provided on the upper surfaces of the first semiconductor layer and the second semiconductor layer respectively, the electrode defining a first recess, wherein an inner surface of the first recess and the upper surface of the first semiconductor layer form a first angle different from a degree of an angle formed by the inner surface of the first recess and the upper surface of the second semiconductor layer, wherein the electrode further defines a second recess, and the second recess is juxtaposed with or nested with the first recess, and a half of a difference value between an opening width of the second recess and an opening width of the first recess is smaller than a depth of the second recess. 2. The light emitting diode chip according to claim 1 , whereinthe first angle formed between the inner surface of the first recess and the upper surface of the first semiconductor layer ranges from 30 degrees to 90 degrees. 3. The light emitting diode chip according to claim 1 , whereinan inner surface of the second recess and the upper surface of the first semiconductor layer form a second angle ranging from 30 degrees to 90 degrees therebetween. 4. The light emitting diode chip according to claim 1 , whereinthe second recess surrounds externally the first recess. 5. The light emitting diode chip according to claim 4 , whereinthe first recess and the second recess are concentric annuluses. 6. The light emitting diode chip according to claim 1 , wherein:the first semiconductor layer comprises a p-type semiconductor layer; the second semiconductor layer comprises an n-type semiconductor layer; and an active layer is provided between the first semiconductor layer and the second semiconductor layer. 7. The light emitting diode chip according to claim 1 , whereinthe light emitting diode chip comprises a micro-light emitting diode chip having a size ranging from 1 μm to 100 μm. 8. The light emitting diode chip according to claim 1 , whereinthe first recess extends along a direction perpendicular to the upper surfaces of the first semiconductor layer and the second semiconductor layer. 9. The light emitting diode chip according to claim 1 , wherein the first recess has an opening width smaller than a depth of the first recess. 10. The light emitting diode chip according to claim 1 , wherein:the light emitting diode chip further comprises a substrate, and a material of the substrate is any one of Si, SiC, GaN, ZnO and sapphire. 11. The light emitting diode chip according to claim 10 , whereinthe light emitting diode chip further comprises a buffer layer provided between the substrate and the second semiconductor layer. 12. A method for manufacturing a light emitting diode chip, comprising:forming a first semiconductor layer and a second semiconductor layer laminated to each other, wherein the first semiconductor layer has an upper surface; etching the first semiconductor layer to expose at least part of an upper surface of the second semiconductor layer; depositing electrodes on exposed parts of the first semiconductor layer and the second semiconductor layer; etching the electrodes to form a plurality of first recesses; and etching the electrodes to form a plurality of second recesses, wherein an inner surface of the first recess and the upper surface of the first semiconductor layer form a first angle different from a degree of an angle formed by the inner surface of the first recess and the upper surface of the second semiconductor layer, wherein the second recess is juxtaposed with or nested with the first recess, and a half of a difference value between an opening width of the second recess and an opening width of the first recess is smaller than a depth of the second recess. 13. The method for manufacturing a light emitting diode chip according to claim 12 , wherein the forming the first semiconductor layer and the second semiconductor layer laminated to each other comprises:providing a substrate; forming a buffer layer, the second semiconductor layer, an active layer, and the first semiconductor layer on the substrate sequentially; and the method for manufacturing a light emitting diode chip further comprises: etching the active layer to expose a part of the second semiconductor layer. 14. The method for manufacturing a light emitting diode chip according to claim 12 , whereinthe etching the electrodes to form a plurality of first recesses comprises patterning the electrodes by a photolithography process to form the plurality of first recesses. 15. The method for manufacturing a light emitting diode chip according to claim 12 , whereinthe etching the electrodes to form a plurality of second recesses comprises patterning the electrodes by a photolithography process to form the plurality of second recesses. 16. A display device, comprising:a driving circuit baseplate; and one or more light emitting diode chips being distributed in an array, the light emitting diode chips comprising: a first semiconductor layer and a second semiconductor layer, the first semiconductor layer and the second semiconductor layer being laminated to each other, and the first semiconductor layer and the second semiconductor layer having an exposed upper surface respectively; and an electrode provided on the upper surfaces of the first semiconductor layer and the second semiconductor layer respectively, the electrode defining a first recess; wherein electrodes of the light emitting diode chips are connected to the driving circuit baseplate, the light emitting diode chips being electrically coupled to the driving circuit baseplate, and wherein an inner surface of the first recess and the upper surface of the first semiconductor layer form a first angle different from a degree of an angle formed by the inner surface of the first recess and the upper surface of the second semiconductor layer, wherein the electrode further defines a second recess, and the second recess is juxtaposed with or nested with the first recess, and a half of a difference value between an opening width of the second recess and an opening width of the first recess is smaller than a depth of the second recess. 17. The display device according to claim 16 , wherein,the first recesses of the electrodes have a certain depth in a direction perpendicular to the driving circuit baseplate.
意見(jiàn)反饋
使用該功能遇到問(wèn)題
該功能需要專(zhuān)業(yè)版企業(yè)版VIP權(quán)限，您可以：
您也可以聯(lián)系官方QQ: 2157717237 電話: 13264338900
PatentHub聯(lián)系方式
掃描加專(zhuān)利匯官方微信交流群
