In an exemplary embodiment, the method for manufacturing the light emitting diode chip may further include: etching the electrodes 200 to form a plurality of the second recesses 220.

In an exemplary embodiment, the electrodes 200 may be patterned by a photolithography process to form a plurality of the first recesses 210.

In an exemplary embodiment, the electrodes 200 may also be patterned by a photolithography process to form a plurality of the second recesses 220.

FIG. 3 is a schematic structural diagram of a display device according to an exemplary embodiment of the present application. As shown in FIG. 3, an exemplary embodiment of the present application further relates to a display device 300. The display device 300 includes: a driving circuit baseplate 310 and one or more light emitting diode chips 100 distributed in an array. Electrodes 200 of the light emitting diode chips 100 are fixedly connected to the driving circuit baseplate 310, to electrically connect the array of the light emitting diode chips 100 to the driving circuit baseplate 310.