In an exemplary embodiment, the electrodes 200 have first recesses 210, and the first recesses 210 have a depth in a direction perpendicular to the driving circuit baseplate 310, so that a cavity structure or a groove structure is formed on the electrodes 200 by the first recesses 210. In an exemplary embodiment, an opening width W of the first recesses 210 is smaller than a depth H of the first recesses 210 (referring to FIG. 2), so that the first recesses have an elongated structure with a relatively small pore size, thereby enhancing the capillarity action and facilitating the solder to enter the first recesses 210 more easily.

The patterned electrodes 200 is used in the display device 300 of the present application, and the first recesses 210 are provided on the electrodes 200, increasing the contact between the electrodes 200 and the solder, improving the soldering strength of the light emitting diode chip 100, and enhancing reliability of the display device 300.

In an exemplary embodiment, the light emitting diode chip 100 may emit one of red light, green light, or blue light.

Each of technical features of the above-described exemplary embodiments may be combined arbitrarily. To simplify the description, not all of possible combinations of each of the technical features in the above exemplary embodiments are described. However, all of the combinations of these technical features should be considered as within the scope of the present specification, as long as such combinations do not contradict with each other.