To illustrate the technical solutions according to the exemplary embodiments of the present application more clearly, the accompanying drawings for describing the exemplary embodiments are introduced briefly below. Apparently, the accompanying drawings in the following description are only some exemplary embodiments of the present application, and a person of ordinary skill in the art can derive other drawings from the accompanying drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a light emitting diode according to an exemplary embodiment of the present application.

FIG. 2 is a schematic cross-sectional structural diagram of the light emitting diode shown in FIG. 1 along a sectional line A-A.

FIG. 3 is a schematic structural diagram of a display device according to an exemplary embodiment of the present application.

In the prior art, in order to improve the soldering strength between the Micro-LED chip and the driving back plate, a solder is generally selected for improvement of the soldering strength. For example, a material, such as gold-tin alloy, soldering tin, and the like, is used. However, in a case of a small area of an electrode, a bonding force of the soldering is still insufficient.

Specific exemplary embodiments of the present application will be described in detail hereinafter with reference to the accompanying drawings.