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LED chips, method of manufacturing the same, and display panels

專利號
US10868217B2
公開日期
2020-12-15
申請人
Kunshan New Flat Panel Display Technology Center Co., Ltd.; Kunshan Go-Visionox Opto-Electronics Co., Ltd.
發(fā)明人
Dong Wei; Rubo Xing; Huimin Liu; Xiaolong Yang; Jiantai Wang
IPC分類
H01L33/38; H01L33/62; H01L23/00; G09G3/32
技術(shù)領(lǐng)域
electrode,extension,layer,contact,led,second,first,concave,spots,soldering
地域： Kunshan

摘要

An LED chip provided by an embodiment includes a first semiconductor layer; an active layer and a second semiconductor layer located sequentially on the first semiconductor layer. A first contact electrode extends through the active layer and the second semiconductor layer and is electrically connected to the first semiconductor layer; a second contact electrode is located on the second semiconductor layer and is electrically connected to the second semiconductor layer; a first extension electrode is located on the first contact electrode and is electrically connected to the first contact electrode, the first extension electrode comprises a plurality of concave spots for soldering; and a second extension electrode is located on the second contact electrode, electrically connected to the second contact electrode and isolated from the first extension electrode, and the second extension electrode includes a plurality of concave spots for soldering.

說明書

FIG. 19 is a cross-sectional diagram illustrating a display panel according to an exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION

As the size of the LED chip electrode is reduced (as illustrated in FIG. 1 and described above), the number of dead pixels in the Micro-LED display panel is multiplied, thereby affecting the yield of the display panel.

It can be seen from the background that as the size of the LED chip electrode is reduced, the number of dead pixels in the Micro-LED display panel is multiplied, thereby affecting the yield of the Micro-LED display panel. The reason for the increase in the number of dead pixels in the Micro-LED display panel is analyzed in conjunction with FIG. 1:

In the manufacturing process of the actual Micro-LED, after the LED chip shown in FIG. 1 is manufactured, a sapphire substrate 1 of the LED chip is removed, and a plurality of LED chips are bonded on a driving backboard, thereby achieving batch transfer of LED chips.

Specifically, a first contact electrode 6 or a second contact electrode 7 is connected to the driving backboard by a soldering process during the process of bonding, so that the circuit unit on the driving backboard can apply a voltage to the first contact electrode 6 and the second contact electrode 7.

權(quán)利要求

1
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