In this exemplary embodiment, the first conductive layer 110 is made of metal, such as gold, silver or aluminum. The metal may be reflective, thereby improving the light extraction efficiency of the LED chip.

In an actual process, the first conductive layer 110 may be formed by an evaporation method. In other exemplary embodiments, the first conductive layer 110 may also be formed by a sputtering or electroplating process.

In this exemplary embodiment, the thickness of the first conductive layer 110 is smaller than the thickness of the nanoimprint pattern layer 109, so that a top surface of the first conductive layer 110 on the forming surface A is lower than a top surface of the nanoimprint layer 109 such that the first conductive layer 110 on the forming surface A is isolated from the first conductive layer 110 on the top surface of the nanoimprint pattern layer 109 to facilitate to remove the first conductive layer 110 on the top surface of the nanoimprint pattern layer 109 by removal of the nanoimprint pattern in a subsequent process, and retain the first conductive layer 110 on the forming surface A.