In order to solve the technical problem, the present disclosure further provides an LED chip including a first extension electrode electrically connected to the first contact electrode, and a second extension electrode electrically connected to the second contact electrode. Each of the first extension electrode and the second extension electrode includes a plurality of concave spots for soldering. Thus, when the LED chip is soldered on the driving backboard, the concave spots for soldering can accommodate the solder, increasing the area of contact of the solder with the first extension electrode and the second extension electrode. The first extension electrode or second extension electrode may have strong soldering force with the driving backboard, so that it is not easy to fall off from the driving backboard which leads to a phenomenon of solder invalidation, thereby improving the yield of the display panel.

With continued reference to FIG. 11 and FIG. 12, there are shown cross-sectional and top views, respectively, of an LED chip according to an exemplary embodiment of the present disclosure. In this exemplary embodiment, the LED chip includes:

a first semiconductor layer 101, an active layer 102 and a second semiconductor layer 103 sequentially located on the first semiconductor layer 101. The first semiconductor layer 101, the active layer 102, and the second semiconductor layer 102 are used to constitute a core of a light emitting diode, which is a functional layer of the LED chip. In this exemplary embodiment, the first semiconductor layer 101 is located on the substrate 100.