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LED chips, method of manufacturing the same, and display panels

專(zhuān)利號(hào)
US10868217B2
公開(kāi)日期
2020-12-15
申請(qǐng)人
Kunshan New Flat Panel Display Technology Center Co., Ltd.; Kunshan Go-Visionox Opto-Electronics Co., Ltd.
發(fā)明人
Dong Wei; Rubo Xing; Huimin Liu; Xiaolong Yang; Jiantai Wang
IPC分類(lèi)
H01L33/38; H01L33/62; H01L23/00; G09G3/32
技術(shù)領(lǐng)域
electrode,extension,layer,contact,led,second,first,concave,spots,soldering
地域: Kunshan

摘要

An LED chip provided by an embodiment includes a first semiconductor layer; an active layer and a second semiconductor layer located sequentially on the first semiconductor layer. A first contact electrode extends through the active layer and the second semiconductor layer and is electrically connected to the first semiconductor layer; a second contact electrode is located on the second semiconductor layer and is electrically connected to the second semiconductor layer; a first extension electrode is located on the first contact electrode and is electrically connected to the first contact electrode, the first extension electrode comprises a plurality of concave spots for soldering; and a second extension electrode is located on the second contact electrode, electrically connected to the second contact electrode and isolated from the first extension electrode, and the second extension electrode includes a plurality of concave spots for soldering.

說(shuō)明書(shū)

Referring to FIGS. 11 and 12, the projection of the circular extension electrode and the circular contact electrode on the forming surface A constitutes a structure of concentric circles. Thus, when the LED chip is soldered to the driving circuit, the solder is located at the center of the concentric circles, which ensures a large area of contact between the driving circuit and the circular extension electrode, and between the circular extension electrode and the circular contact electrode, thereby increasing the soldering strength.

It should be noted that, in other exemplary embodiments, the first extension electrode is electrically connected to the first contact electrode, and the second extension electrode is electrically connected to the second contact electrode. The projection of the circular extension electrode and the circular contact electrode on the forming surface A may also be in a structure with intersecting circles, inscribed circles or an inner circular.

In this exemplary embodiment, the first extension electrode 111 and the second extension electrode 121 are made of metal, such as gold, silver or aluminum. The metal can be reflective, thereby improving the light extraction efficiency of the LED chip. In other exemplary embodiments, the first extension electrode and the second extension electrode may also be made of other conductive materials.

權(quán)利要求

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