In this exemplary embodiment, the thickness of the second insulating layer 112 is greater than the thickness of the first extension electrode 111 or the second extension electrode 121. In this way, in addition to the electrical isolation of the first extension electrode 111 and the second extension electrode 121, the second insulating layer 112 can physically isolate the solder on the different extension electrodes during the soldering process, thereby achieving electrical isolation. Specifically, the thickness of the second insulating layer 112 is in a range of 1 μm to 10 μm.

The second insulating layer 112 is made of silicon nitride, silicon oxide or the like.

It should be noted that, in other exemplary embodiments, the second insulating layer may not be disposed, and when the LED chip is soldered to the driving circuit, the solders respectively located on the first extension electrode and the second extension electrode are not connected together by precise soldering process control, thereby avoiding a short circuit between the first extension electrode and the second extension electrode.

Referring to FIG. 13, a top view of an LED chip according to another exemplary embodiment of the present disclosure is shown. The same points in this exemplary embodiment as the previous exemplary embodiment will not be described again. The difference is that a partial area of the first extension electrode in the LED chip of this exemplary embodiment is used to form a plurality of concave spots.