As shown in FIG. 19, the concave spots of the first extension electrode 111 in the LED chip are filled with solder 30 and soldered to the first electrical terminal 21. The concave spots of the second extension electrode 121 are filled with solder 30 and soldered to the second electrical terminal 22. The solder 30 is filled in the concave spots so that the soldering area is increased and the soldering strength is enhanced, thereby reducing the problem of the solder invalidation of the LED chip from the driving backboard 20, reducing the probability of occurrence of the dead pixel, and improving the yield of the display panel.

Specifically, the substrate 24 may be a rigid substrate, or may be a flexible substrate, a folded substrate, or a stretched substrate.

The present disclosure also provides an electronic device including the display panel provided by the present disclosure. The probability of occurrence of a dead pixel in the display panel is small, and accordingly, the electronic device has good reliability, long service life, and low repair rate.

The electronic device may be a mobile phone, a near-eye display device (VR or AR), a television, a wearable device, or the like.

Although the present disclosure has been disclosed above, the present disclosure is not limited thereto. Any changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the application, and the scope of the application should be determined by the scope of the claims.