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Method for manufacturing chip-mounting substrate, and chip-mounting substrate

專利號
US10868221B2
公開日期
2020-12-15
申請人
POINT ENGINEERING CO., LTD.（KR Asan）
發(fā)明人
Bum Mo Ahn; Seung Ho Park; Tae Hwan Song
IPC分類
H01L21/48; H01L33/48; H01L23/00; H01L33/62; H01L33/60; H01L33/46; H01L23/498
技術領域
substrate,metal,precoat,uneven,formed,chip,coating,layer,portion,insulating
地域： Asan

摘要

A method for manufacturing a chip-mounting substrate includes a pre-coating step of forming a precoat on a substrate including a plurality of conductive portions and an insulating portion interposed between the conductive portions, an etching step of etching at least a portion of the precoat through a laser to form a pattern, and a step of forming a metal layer on the substrate. The pattern is disposed on at least one of the conductive portions, and the metal layer is formed in the pattern.

說明書

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CROSS-REFERENCE TO RELATED PATENT APPLICATION

This U.S. non-provisional patent application claims priority under 35 U.S.C. § 119 of Korean Patent Application No. 10-2016-0060377 filed on May 17, 2016 in the Korean Patent Office, the entire contents of which are hereby incorporated by reference.

TECHNICAL FIELD

The present invention relates to a method for manufacturing a chip-mounting substrate and, more particularly, to a method for manufacturing a chip-mounting substrate, which includes an etching step of etching at least a portion of a precoat through a laser to form a pattern and a step of forming a metal layer in the pattern.

BACKGROUND

In general, a light demitting diode (LED) as a semiconductor light demitting diode is an environment-friendly light source not causing pollution. The light demitting diode draws attention in a variety of fields. In recent years, as the use range of LEDs is expanded to various fields such as an indoor/outdoor lighting, an automobile headlight and a backlight unit (BLU) of a display device, there is a need to achieve high luminous efficiency and excellent heat dissipation characteristics. In order to obtain a high efficiency LED, it is necessary to primarily improve the material or structure of the LED. In addition, it is also necessary to improve the structure of an LED package and the materials used for the LED package.

權利要求

1
What is claimed is:1. A method for manufacturing a chip package comprises:forming an uneven portion on an upper surface of a metal substrate on which an insulating portion for electrically separating the metal substrate, as to apply electricity to each of the electrode portions of a chip;forming a metal layer on the uneven portion; andmounting the chip on the metal layer,wherein forming the uneven portion comprises forming the uneven portion on the upper surface of the metal substrate by irradiating a laser on the upper surface of the metal substrate, so as to be formed only on a part of the upper surface of the metal substrate,wherein forming the metal layer comprises: forming the metal layer only on the uneven portion, so as to protrude upwards at a predetermined height from the upper surface of the metal substrate, wherein the metal layer is not formed on the upper surface of the metal substrate except for the uneven portion,wherein mounting the chip comprises: mounting the chip to receive the electricity from the metal substrate so that the electricity supplied to the metal substrate is transferred to the chip through the metal substrate, the uneven portion, and the metal layer.
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