However, this method has a problem in that high plating cost is required. Furthermore, a problem is posed in that chemical corrosion occurs due to the inclusion of a chemical etching work. Moreover, the process is complex.

In another conventional method differing from the aforementioned method, as shown in FIG. 3, a photoresist coating 4 is formed on a metal substrate 110 having an insulating portion 120 and is allowed to cure. After a mask 5 having a pattern formed in a bump shape is disposed on the photoresist coating 4, a pattern is formed on the photoresist coating 4 through ultraviolet exposure and development. Bumps 130 are formed in the pattern. The remaining photoresist coating 4 is removed.

However, in the method using the mask in this way, there is a problem in that a separate mask is required. Furthermore, the use of the flat mask poses a problem that the accuracy decreases when the bumps 130 are formed on a metal substrate having a cavity 140. In addition, it is difficult to manufacture a mask bent in a shape corresponding to the shape of the cavity 140 having a small size.

Patent Document 1: Korean Patent Registration No. 10-1582494

In view of the problems mentioned above, it is an object of the present invention to provide a method for manufacturing a chip-mounting substrate, which does not require a separate mask, uses a simple process and enhances accuracy.